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Image Correction ICs
Image Correction IC for Camera
BU1571KN
Description BU1571KN is AIE : Adaptive Image Enhancer (image processing technology by ROHM's hardware). Provides unprecedented visibility under severe conditions, such as darkness or extreme backlighting. Features 1) UXGA size (16001200) for input of image data up to 7.5 fps, SXGA size (12801024) for input of image data up to 15 fps and VGA size (640480) for input of image data up to 30 fps. 2) Input data format for YUV=4:2:2 8bit. Order of components may be adjusted by the register. 3) Operation modes are image enhance mode, through mode, and sleep mode. 4) Strength of image correction can be set to linear. 5) Register can be set up with a 2-line serial interface.
*Extra document is prepared separately about each register setup. Please refer to the Development Scheme on page 6.
No.10060ECT01
Application Security camera, Intercom with camera, Drive recorder, and Web camera etc. Lineup matrix Parameter Supply power source voltage 1.45-1.55(VDDCore) 2.7-3.6(VDDIo) Camera Interface Supported up to Max 2M pixels. (1600x1200) Control Interface I2C BUS Output Interface 8bit YUV=4:2:2 Camera interface Interrupt output Package
BU1571KN
VQFN36
Absolute maximum ratings
(Ta=25) Symbol VDDIO VDD VIN Tstg PD Ratings -0.3 ~ +4.2 -0.3 ~ +2.1 -0.3 ~ VDDIO+0.3 -40 ~ +125 450 Unit V V V mW
Parameter Supply power source voltage 1 Supply power source voltage 2 Input voltage Storage temperature range Power dissipation
*In the case exceeding 25, 4.5mW should be reduced at the rating 1.
Recommended operating range Parameter Supply power source voltage 1(IO) Supply power source voltage 2(CORE) Input voltage range Operating temperature range
*Please supply power source in order of VDDVDDIO.
Symbol VDDIO VDD VIN-VDDIO Topr
Ratings 2.70 ~ 3.60(Typ:3.3V) 1.45 ~ 1.55(Typ:1.50V) 0 ~ VDDIO -40 ~ +85
Unit V V V
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Electric characteristics (Unless otherwise specified, VDD=1.50V,VDDIO=3.3V,GND=0.0V,Ta=25,fIN=52.0MHz) Limits Parameter Symbol Unit MIN. TYP. MAX. Input frequency Operating consumption current Static consumption current Input "H" current 1 Input "H" current 2 Input "L" current 1 Input "L" current 2 Input "H" voltage 1 Input "L" voltage 1 Input "H" voltage 2 Input "L" voltage 2 Hysteresis voltage width Output "H" voltage Output "L" voltage fIN IDD1 IDDst IIH1 IIH2 IIL1 IIL2 VIH1 VIL1 VIH2 VIL2 Vhys VOH VOL 10.0 -10 35 -10 -10 VDDIO 0.8 -0.3 VDDIO 0.85 -0.3 VDDIO -0.4 0.0 15 70 0.5 52.0 30 10 140 10 10 VDDIO +0.3 VDDIO 0.2 VDDIO +0.3 VDDIO 0.15 VDDIO 0.4
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Condition
MHz CAMCKI(DUTY45% ~ 55%) mA A A A A A V V V V V V V At enhance mode setting At sleep mode setting, input terminal=GND setting VIH=VDDIO Pull-Down terminal, VIH=VDDIO VIL=GND Pull-Down terminal, VIL=GND Normal input (including input mode of I/O terminal) Normal input (including input mode of I/O terminal) Hysteresis input (RESETB, CAMCKI, SDA, SDC) Hysteresis input (RESETB, CAMCKI, SDA, SDC) Hysteresis input (RESETB, CAMCKI, SDA, SDC) IOH=-1.0mA(DC) (including input mode of I/O terminal) IOL=1.0mA(DC) (including input mode of I/O terminal)
Block Diagram
Recommended Application Circuit
CAMDI[7:0]
8
YUV=4:2:2
Color Correction
Luminance Distinction
8
CAMDO[7:0] YUV=4:2:2
CAMDI[7:0]
CAMDI[7:0]
CAMDO[7:0] CAMHSO CAMVSO
CAMDO[7:0] CAMHSO CAMVSO CAMCKO Image Processing IC
CAMHSI
CAMHSI
Image Enhance
CAMVSI Camera Module CAMCKI
BU1571KN
CAMVSI CAMCKI
CAMCKO SDA SDC
SDA
SDC
Serial Interface
SDA SDC
CAMHSI CAMVSI CAMCKI
CAMHSO Timing Generator CAMVSO CAMCKO
HOST CPU
*Extra document is prepared separately about system evaluation. Please refer to the Development Scheme on page 6.
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Terminal functions PIN No. PIN Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 CAMVSI N.C. CAMHSI CAMDI0 CAMDI1 CAMDI2 CAMDI3 CAMDI4 CAMDI5 CAMDI6 CAMDI7 VDDIO CAMCKI GND VDD SDA SDC TESTOUT CAMVSO N.C. CAMHSO CAMDO0 CAMDO1 CAMDO2 CAMDO3 CAMDO4 CAMDO5 CAMDO6 CAMDO7 TEST1 TEST2 RESETB VDDIO CAMCKO GND VDD Out Out Out Out Out Out Out Out Out In In In Out DATA DATA DATA DATA DATA DATA DATA DATA Low Low Low PWR CLK GND PWR Horizontal Timing Signal Output Data Output: Bit 0 Data Output: Bit 1 Data Output: Bit 2 Data Output: Bit 3 Data Output: Bit 4 Data Output: Bit 5 Data Output: Bit 6 Data Output: Bit 7 Test Mode Terminal 1 (Connect to GND) Test Mode Terminal 2 (Connect to GND) System Reset Signal DIGITAL IO Power Source Clock Output Common GROUND CORE Power Source In In In In In In In In In In In/Out In/Out Out Out * DATA DATA DATA DATA DATA DATA DATA DATA PWR CLK GND PWR DATA CLK High In In Horizontal Timing Input (pull-down at sleep mode) Data Input Bit 0 (pull-down at sleep mode) Data Input Bit 1 (pull-down at sleep mode) Data Input Bit 2 (pull-down at sleep mode) Data Input Bit 3 (pull-down at sleep mode) Data Input Bit 4 (pull-down at sleep mode) Data Input Bit 5 (pull-down at sleep mode) Data Input Bit 6 (pull-down at sleep mode) Data Input Bit 7 (pull-down at sleep mode) DIGITAL IO Power Source Clock Input (pull-down at sleep mode) Common GROUND CORE Power Source In/Output Serial Data In/Output Serial Clock TEST Out Pin ( Keep Open ) Vertical Timing Signal Output In/Out Active Level In * Init Function explanation Vertical Timing Input (pull-down at sleep mode)
Technical Note
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I/O type B*1
B*1 B*1 B*1 B*1 B*1 B*1 B*1 B*1 B*1 D*1 E E C
C C C C C C C C C B B A C -
*"*" in the Active Level column indicates that it may be changed during set-up of the register. Init indicates pin status when released from reset. *1: Pull-down is ON during reset (initial status).
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Equivalent Circuit Structures of input / output pins Type The equivalent circuit structure
VDDIO
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Type
The equivalent circuit structure
VDDIO VDDIO Internal signal
To internal
A
GND
B
To internal
GND
GND
GND
Input terminal with Schmitt
VDDIO VDDIO
Input terminal with PULL-DOWN
VDDIO Internal signal
Internal signal
C
D
GND GND GND GND
To internal
Output terminal
VDDIO VDDIO VDDIO To internal Internal signal
Hysteresis input terminal with PULL-DOWN
E
GND
Internal signal
GND GND
Internal signal
Hysteresis input / output terminal
Terminal Layout (Bottom View)
CAMDI0
CAMVSI
CAMHSI
CAMDI5
CA MDI3
CAMDI1
CAMDI2
CAMDI4
N.C.
VDD GND CAMCKO VDDIO RESETB TEST2 TEST1 CAMDO7 CAMDO6
CAMDI6 CAMDI7 VDDIO CAMCKI GND VDD SDA SDC TESTOUT
CAMDO5
CAMDO4
CAMDO3
CAMDO2
CAMDO1
N.C.
CAMDO0
CAMHSO
CAMVSO
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BU1571KN
Timing Chart 1. Two-line serial interface 1.1 Two-line serial interface timing
SDA
tSU;DAT
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tLOW
tHD;ST
tBUF
SDC
tHD;STA tHD;DAT tHIGH tSU;STA tSU;STO
Table 1 I2C Interface timing Symbol fSCL tHD;STA fLOW tHIGH tSU;STA tHD;DAT tSU;DAT tSU;STO tBUF Parameter SDC Clock Frequency Hold-time(repetition)STARTconditions (The first clock pulse is generated after this period.) The "L" period of SDC clock The "H" period of SDC clock Setup time of repetitive STARTconditions Hold time of SDA Setup time of SDA Setup time of the STOPconditions BUS free time between STOPconditions and the STARTconditions MIN. 0 0.6 1.3 0.6 0.6 0 100 0.6 1.3 TYP. MAX. 400 Unit kHz s s s s s ns s s
2. Camera module interface 2.1. Camera module interface timing The input timing of camera image signal on camera I/F is shown in Table 2. Table 2.
CAMVSI CAMHSI CAMDI0 CAMDI7 CAMCKI (CKPOL="1") CAMCKI (CKPOL="0") tCMS tCMH
BU1571KN timing (Camera data input)
Explanation CAMCKI Rise / Fall Camera set-up Time CAMCKI Rise / Fall Camera Hold Time MIN. TYP. MAX. UNIT 4 4 ns ns
Symbol tCMS tCMH
The input timing of camera image signal on camera I/F is shown in Table 2.1-2.
tPCLK CAMCKO tPHH CAMVSO CAMHSO tPDV CAMDO[7:0]
Table 2.
Symbol tPCLK
tPHL
Camera data output timing
Explanation Clock Cycle Clock Duty Decision of CAMDO from CAMCKO Decision of CAMVSO or CAMHSO from CAMCKO MIN. TYP. MAX. UNIT 19.2 45 50 55 5 5 ns % ns ns
dPCLK tPDV tPHL, tPHH
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Technical Note
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Development Scheme This technical note is aimed at trying the connectivity in the hardware between customer's system and our AIE Adaptive Image Enhancer series. We prepare various data and tools for every development STEP as follows other than this technical note, please contact the sales staff in your duty also including the support system. (1) Demonstration STEP (You can try the standard image processing functions by the standard Demonstration kit at once.) You can confirm on TV screen what carried out AIE processing of a camera image and the DVD video image. Standard Demonstration board kit Demonstration board(TV-INBU1571KNTV-OUT board) Demonstration board operation manual Demonstration software If the software for the trial board is installed in your Windows PC(Windows 2000/XP), more detailed setting is possible. USB cable (2) Confirmation STEP (We will respond to customer's camera module.) Specifications We will provide specifications for AIE Adaptive Image Enhancer according to customer's requirements. Function explanation We will deliver you the function explanation describing detailed functions, register settings, external interfaces, timing, and so forth of AIE Adaptive Image Enhancer according to your requests. Application note We will deliver you the detailed explanation data on application development of AIE Adaptive Image Enhancer according to your requests. (3) System check STEP (You can check the application operation as a system by the kit of system check tools and your camera module.) You can check the interface with your camera module and the application operation on the system check board using the tools for user's only. System check tools kit Board for system evaluation Manual for system evaluation Macro command file for reference
*You can check the detailed functions of the application operation by your PC using the macro command file.
(4) Integrated check STEP with user's system (You can check the application operation as a system on your system check board using the integrated check software.) You can check the application operation on the sample LSI-equipped system check board by your camera module using the integrated check software. On line SupportWe will answer your questions about the software development.
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Notes for use (1)Absolute Maximum Ratings
Technical Note
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An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc.
(2)Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter.
(3)Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC's power supply terminal.
(4)Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5)GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6)Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down.
(7)Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8)Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB.
(9)Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(10)Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11)External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
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BU1571KN
Ordering part number
Technical Note
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B
D
1
Part No.
5
7
1
K
N
-
E
2
Part No.
Package KN:VQFN36
Packaging and forming specification E2: Embossed tape and reel
VQFN36
(1.1) 6.2 0.1 6.0 0.1
27 19 18

Tape Quantity Direction of feed
0.95MAX
Embossed carrier tape (with dry pack) 2500pcs E2
The direction is the 1pin of product is at the upper left when you hold
6.20.1
6.00.1
28
36 1 9
10
0.22 0.05
0.08
M
( reel on the left hand and you pull out the tape on the right hand
)
+0.1 0.6 -0.3
0.220.05
+0.03 0.02 -0.02
0.05
3.3 (0
2)
(0 .2
(0 .5 )
0.5
5)
Notice : Do not use the dotted line area for soldering
1pin Reel
Direction of feed
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
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Notice
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Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us.
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